Elmos Semiconductor
This article has multiple issues. Please help improve it or discuss these issues on the talk page. (Learn how and when to remove these messages)
|
Company type | Public company |
---|---|
Industry | Electrical engineering |
Founded | 1984 |
Headquarters | , |
Area served | automotive |
Products | Semiconductors, microstructures |
Subsidiaries | Silicon Microstructures |
Website | http://www.elmos.de/ |
Footnotes / references Garnter ranked #2 Automotive ASIC Supplier |
Elmos Semiconductor SE is a German manufacturer of semiconductor products headquartered in Dortmund, Germany. Elmos supplies automotive application-specific integrated circuits (ASICs).
History
[edit]- 1984 - Founded in Dortmund, Germany
- 1985 - 32 employees, 0.4 M DM turnover, Installation of 4" Wafer Fab in Dortmund
- 1994 - DIN ISO 9001 certificate
- 1998 - 460 employees, 140 M DM turnover. Complete supply from new 6" line
- 1999 - IPO to new market, Frankfurt
- 2001 - 630 employees, 107 million Euro turnover Acquisition of Eurasem (Packaging, NL) and SMI (MEMS, USA)
- 2002 - TS16949
- 2005 - Opened 8" wafer fab in Duisburg as second production line
- 2020 - Conversion of legal form into a Societas Europaea[1]
- 2022 - media reports about possible Chinese takeover[2] which the German government eventually vetoed[3]
Silicon Microstructures
[edit]Silicon Microstructures, Inc.(SMI) was founded in 1991 as a commercial source of high-performance silicon pressure sensors, including Microelectromechanical systems sensors, and accelerometers. Its first product was a silicon sensor for very low-pressure usage. SMI was acquired in March 2001 from OSI Systems.[4] SMI began production on higher performance, system level sensors and microstructures, wireless, RF and bus addressable microstructures. In August 2002, SMI acquired the IC Sensors' wafer fabrication operations and wafer R&D group and relocated to Milpitas, California. The following year, Silicon Microstructures undertook a significant and complete wafer fabrication upgrade to expand the facility for full 6" wafer handling.
This facility processed primarily 6 inch wafers and has advanced technical capabilities including deep reactive ion etching (DRIE) and plasma enhanced fusion bonding.[clarification needed]
References
[edit]- ^ "Öffentliche Bekanntmachung RegisSTAR".
- ^ "Germany likely to block Chinese takeover of Elmos' chip production". Reuters. 2022-11-07. Retrieved 2023-05-09.
- ^ Rinke, Andreas; Murray, Miranda (10 November 2022). "Germany blocks Chinese stake in two chipmakers over security concerns". Reuters.
- ^ "OSI Systems sells subsidiary SMI to Elmos Semiconductor" (Press release). March 13, 2001. Retrieved 2 September 2016.
External links
[edit]